TestOut LabSim A+ Certification Practice Exam

Where should thermal paste be applied when installing a new processor?

1. Between the motherboard and CPU

2. Between the heat sink and CPU

3. On the processor's pins

4. On the cooling fan

The correct answer is: Between the heat sink and CPU

Thermal paste should be applied between the heat sink and the CPU to ensure that heat is effectively transferred from the processor to the cooling solution. The primary purpose of thermal paste is to fill microscopic gaps that may exist on the surfaces of the CPU and the heat sink. These gaps can trap air, which is an inefficient conductor of heat. By applying thermal paste, a better thermal interface is created, allowing for more efficient heat dissipation away from the CPU. When the heat sink is mounted on the CPU, it absorbs heat produced by the processor and dissipates it into the surrounding environment. If thermal paste is not applied in this area, the CPU could overheat, leading to potential thermal throttling or even permanent damage. Other options describe incorrect applications: applying thermal paste between the motherboard and CPU introduces unnecessary material that could impede the connection, placing it on the processor's pins obstructs the connection to the motherboard, and applying it on the cooling fan does not serve any function in heat transfer between the CPU and the heat sink.